High Temperature Polyimide Label Material is designed for PCB manufacturing, SMT processes, wave soldering, reflow soldering, electronic component tracking, barcode identification, and industrial high-temperature labeling applications. It provides stable polyimide film performance, reliable adhesion, good printability, barcode readability, dimensional stability, and OEM/ODM roll material supply for label converters and electronics manufacturers.
German 
English 
Spanish 
Russian 
French 
Portuguese 
Italian 
Arabic 
Turkish